65pcs Automatic die-bonding machine

65 PCS of automatic die bonding machines, 13lines of reflow soldering machines, and 4 linesof phosphor glue dispensing machines. Thesea monthly capacity of 1,000000 ensure meters. The initial yield rate of SKYBALL COB Strip is an impressive 99.8%

Roll to Roll Tech.

Roll-to-roll die-bonding and phosphor glue dispensing can streamline the process, improve production efficiency, and eliminate handling losses and time wasted during process transfer.The Roll-to-roll FPC process eliminates the risk of manual welding errors, such as hand fake welding, dry joints, and insufficient soldering, ensuring consistent high quality. As a result, the initial yield rate of SKYBALL COB Strip reaches an impressive 99.8%.

FLIP-CHIP TECHNOLOGY

The term "flip-chip technology" refers to a form of LED chip integration where the chips are directly attached to a flexible printed circuit (FPC), eliminating the need for brackets. This technology allows for customizable light emitting areas and diameters based on the shape and structure of the products.

1999

Company Established

2500

Cases Won

69

Main business suppliers

595

Trusting Clients